CHARTLEY, Mass. – Ceramics Process Systems Corp. today announced it has expanded its product line to include hermetic microelectronic packages.
CPS has been supplying AlSiC components for use in hermetic microelectronic packages, and assembling hermetic packages containing AlSiC for certain select customers, since 1987. The company now is able to offer highly engineered hermetic microelectronic packages – made from materials such as Kovar, aluminum and steel, in addition to AlSiC – to the market at large.
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“The strong engineering and manufacturing competencies CPS has developed in our AlSiC business are directly applicable to the broader hermetic microelectronic packaging business,” said Grant Bennett, president of CPS. “We are delighted to respond to the requests of many customers to expand our product line to include hermetic packages made from more-traditional materials, in addition to hermetic packages made from AlSiC.
“This product line expansion is a very attractive business opportunity in and of itself, [and] it will also allow us to accelerate the penetration of AlSiC into a broader number of hermetic packaging applications.”
CPS’ vertically integrated 38,000 square foot manufacturing facility, in Chartley, offers customers in-house tooling capability, state-of-the-art machining capability and strong engineering and design departments, as well as on-staff material scientists. The facility is certified to ISO:9001:2000, and provides quality-assurance testing to MID STD 883 and MIL STD 202 for hermetic packages.
Ceramics Process Systems Corp. (OTC Bulletin Board: CPSX) develops, manufactures and markets advanced metal matrix composites for the electronics, robotics and other industries. CPS’ products are primarily used in high-density integrated circuit packaging, power semiconductor modules, hermetic microelectronic packages and robotic applications. For further information, visit www.alsic.com.
